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DATA SHEET
Solid State Relay OCMOS FET
PS7342-1A,PS7342L-1A
6-PIN DIP, HIGH ISOLATION VOLTAGE 1-ch Optical Coupled MOS FET
DESCRIPTION
The PS7342-1A and PS7342L-1A are solid state relays containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. They are suitable for analog signal control because of their low offset and high linearity. The PS7342L-1A has a surface mount type lead.
FEATURES
* High isolation voltage (BV = 3 750 Vr.m.s.) * 1 channel type (1 a output) * Low LED Operating Current (IF = 2 mA) * Designed for AC/DC switching line changer * Small package (6-pin DIP) * Low offset voltage * PS7342L-1A: Surface mount type * UL approved: File No. E72422 (S) * BSI approved: No. 8252/8253 * CSA approved: No. CA 101391
APPLICATIONS
* Exchange equipment * Measurement equipment * FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P11566EJ6V0DS00 (6th edition) Date Published October 1999 NS CP(K) Printed in Japan
The mark * shows major revised points.
(c)
1996, 1999
PS7342-1A,PS7342L-1A
PACKAGE DIMENSIONS (in millimeters)
PS7342-1A
9.250.5 6 5
TOP VIEW
4 1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain
1
2
3
7.62 6.50.5
3.30.3 4.150.3 3.50.3
0.50.1 1.340.1 0.25 M
0 to 15 2.54
PS7342L-1A
9.250.5 6 5
TOP VIEW
4 1. LED Anode 2. LED Cathode 3. NC 4. MOS FET Drain 5. MOS FET Source 6. MOS FET Drain
1
2
3
6.50.5
3.50.3 0.10+0.10 -0.05
1.340.1 0.25 M
2.54
0.90.25 9.600.4
2
Data Sheet P11566EJ6V0DS00
PS7342-1A,PS7342L-1A
ORDERING INFORMATION
Part Number PS7342-1A PS7342L-1A PS7342L-1A-E3 PS7342L-1A-E4 Embossed Tape 1 000 pcs/reel Package 6-pin DIP Packing Style Magazine case 50 pcs Application Part Number PS7342-1A PS7342L-1A
*1
*1 For the application of the Safety Standard, following part number should be used.
Data Sheet P11566EJ6V0DS00
3
PS7342-1A,PS7342L-1A
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current
*2 *1
Symbol IF VR PD IFP VL Connection A Connection B Connection C IL
Ratings 50 5.0 50 1 400 200 250 400
Unit mA V mW A V mA
Pulse Load Current
*3
ILP
400
mA
(AC/DC Connection) Power Dissipation Isolation Voltage
*4
PD BV PT TA Tstg
560 3 750 610 -40 to +85 -40 to +125
mW Vr.m.s. mW C C
Total Power Dissipation Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1 % *2 Conditions: IF 2 mA. The following types of load connections are available.
1 2 3 1 2 3 1 2 3 1 2 3 6 5 4 6 5 4 6 5 4 6 5 4 IL IL L L IL + IL IL - + VL (DC) + VL (DC) - IL VL (AC/DC) L L + VL (DC) -
Connection A
IL
Connection B
Connection C
*3 PW = 100 ms, 1 shot *4 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output
4
Data Sheet P11566EJ6V0DS00
PS7342-1A,PS7342L-1A
RECOMMENDED OPERATING CONDITIONS (TA = 25 C)
Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 Unit mA V
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current
MOS FET Off-state Leakage Current
Symbol VF IR ILoff Cout IFon Ron1 Ron2 IF = 10 mA VR = 5 V VD = 400 V
Conditions
MIN.
TYP. 1.2
MAX. 1.4 5.0
Unit V
A A
pF
0.03 225
1.0
Output Capacitance Coupled LED On-state Current On-state Resistance
VD = 0 V, f = 1 MHz IL = 200 mA IF = 10 mA, IL = 10 mA IF = 10 mA, IL = 200 mA, t 10 ms IF = 10 mA, VO = 5 V, PW 10 ms
2.0 6 10
mA
Turn-on Time Turn-off Time
*1
ton toff RI-O CI-O
1.2 0.06
2.5 0.2
ms
*1
Isolation Resistance Isolation Capacitance
VI-O = 1.0 kVDC V = 0 V, f = 1 MHz
10
9
1.1 pF
*1 Test Circuit for Switching Time
IF Pulse Input VL
Input 50 % 0
VO = 5 V
Input monitor Rin RL
VO monitor
Output
90 %
10 % ton toff
Data Sheet P11566EJ6V0DS00
5
PS7342-1A,PS7342L-1A
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100 300
MAXIMUM LORD CURRENT vs. AMBIENT TEMPERATURE
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
80
200
60
40
100
20
0 -25
0
25
50
7580
100
0 -25
0
25
50
75 85
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD VOLTAGE vs. AMBIENT TEMPERATURE
1.8 250 IF = 50 mA 30 mA 20 mA 10 mA 5 mA 1 mA
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
f = 1 MHz
Forward Voltage VF (V)
1.6
Output Capacitance Cout (pF)
200
1.4
150
1.2
100
1.0
50
0.8 -25
0
25
50
75
100
0
20
40
60
80
100
120
Ambient Temperature TA (C)
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE
10-5
LORD CURRENT vs. LORD VOLTAGE
300 IF = 10 mA
Off-state Leakage Current ILoff (A)
TA = 80 C
200
Load Current IL (mA)
10-6
100
10-7
25 C
-1.5
-1.0
-0.5 -100 -200
0
0.5
1.0
1.5
10-8
10-9 0
100
200
300
400
500
-300 Load Voltage VL (V)
Applied Voltage VD (V)
6
Data Sheet P11566EJ6V0DS00
PS7342-1A,PS7342L-1A
NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE
3.0 Normalized On-state Resistance Ron 2.5 2.0 1.5 1.0 0.5 0.0 -25 Normalized to 1.0 at TA = 25 C, IF = 10 mA, IL = 10 mA Number (pcs)
ON-STATE RESISTANCE DISTRIBUTION
30 25 20 15 10 5 0 n = 50 pcs, IF = 10 mA, IL = 10 mA
0
25
50
75
100
5.6
5.8
6.0
6.2
6.4
Ambient Temperature TA (C)
On-state Resistance Ron ()
TURN-ON TIME vs. FORWARD CURRENT
6 VO = 5 V 5
TURN-OFF TIME vs. FORWARD CURRENT
0.6 VO = 5 V 0.5
Turn-on Time ton (ms)
4 3 2 1
Turn-off Time toff (ms)
5 10 15 20 25 30
0.4 0.3 0.2 0.1
0
0
5
10
15
20
25
30
Forward Current IF (mA)
Forward Current IF (mA)
TURN-ON TIME DISTRIBUTION
30 25 n = 50 pcs, IF = 10 mA, VO = 5 V 30 25
TURN-OFF TIME DISTRIBUTION
n = 50 pcs, IF = 10 mA, VO = 5 V
Number (pcs)
15 10 5 0
Number (pcs)
0.8 1.0 1.2 1.4 1.6
20
20 15 10 5 0
0.02
0.04
0.06
0.08
0.10
Turn-on Time ton (ms)
Turn-off Time toff (ms)
Data Sheet P11566EJ6V0DS00
7
PS7342-1A,PS7342L-1A
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0 3.0 Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
Normalized to 1.0 at TA = 25 C, IF = 10 mA, VO = 5 V
Normalized Turn-on Time ton
Normalized Turn-off Time toff
2.5 2.0 1.5 1.0 0.5 0.0 -25
2.5 2.0 1.5 1.0 0.5 0.0 -25
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
8
Data Sheet P11566EJ6V0DS00
PS7342-1A,PS7342L-1A
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
4.30.2
16.00.3 10.30.1
7.50.1
1.550.1 12.00.1
10.40.1
0.3
Tape Direction
PS7342L-1A-E3 PS7342L-1A-E4
Outline and Dimensions (Reel)
1.5
2.00.5 13.00.5
R 1.0
21.00.8
80.05.0
330
16.4 +2.0 -0.0
Packing: 1 000 pcs/reel
Data Sheet P11566EJ6V0DS00
9
PS7342-1A,PS7342L-1A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C (package surface temperature) 30 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 235 C (peak temperature) 210 C to 30 s 100 to 160 C 60 to 120 s (preheating)
Time (s)
(2) Dip soldering * Temperature * Time * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. * Products in dry pack After opening the dry pack, solder the products within the valid storage period specified on the label on the dry pack.
10
Data Sheet P11566EJ6V0DS00
PS7342-1A,PS7342L-1A
[MEMO]
Data Sheet P11566EJ6V0DS00
11
PS7342-1A,PS7342L-1A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

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